MediaTek kicked off the morning with the announcement of its latest chipset powerhouse – the Dimensity 8400. Shortly after, Realme stirred excitement on its official Weibo account by teasing an upcoming smartphone launch. The teaser shared by Realme showcases a design schematic highlighting the new Dimensity 8400 SoC.
Though Realme kept the device’s name under wraps, reliable tipster DCS stepped in with the reveal. According to DCS, the upcoming device will be branded as the Realme Neo 7 SE, joining the lineup alongside its recently launched sibling, the Realme Neo 7 (China).
MediaTek’s press release confirms that a phone with the Dimensity 8400 will launch by the end of this year. At the same time, Redmi is preparing to launch its Turbo 4 with the Dimensity 8400 Ultra variant.
The competition is now between Realme and Redmi. Redmi has started taking reservations for the Turbo 4 in China, planning to launch it in January 2025. Realme has only teased their phone so far, and we’re waiting to see which brand will be the first to release a Dimensity 8400 phone.
