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Alleged Xiaomi Civi 4 tipped to feature Snapdragon 8-series chip

Recent reports have revealed that Xiaomi is working on the Xiaomi Civi 4 smartphone for the Chinese market. Today, tipster Digital Chat Station shared the key specifications of an upcoming smartphone. While he did not mention the name of the device, it seems that he could be talking about the Xiaomi Civi 4.

The device that DCS is talking about in the latest leak has a curved-edge display with a dual punch-hole design, which suggests that it could be equipped with two front-facing cameras. To recall, the Xiaomi Civi 3 and Civi 2 have featured a curved-edge AMOLED display with dual front-facing cameras. Hence, it appears that DCS could be talking about the Civi 4 in today’s leak.

Based on the latest leak, it can be said that the purported Xiaomi Civi 4’s 2.7D display will feature a subtle micro curvature, indicating that it won’t have a pronounced curvature. He claimed that the screen would offer a 1.5K resolution and that the phone would be equipped with a metal middle frame.

The Civi 3 featured the Dimensity 8200, but the Civi 4 is expected to receive a huge upgrade in the performance department. While recent leaks have claimed that the Civi 4 has the Dimensity 8300 Ultra chip, the new leak claims that the engineering prototype of the device was found to be running on a Snapdragon 8-series chip.

It remains to be seen which chip powers the Civi 4, as a recent report claimed that it could be equipped with the upcoming Snapdragon 7+ Gen 3 SoC. The same report also claimed that it has a 50-megapixel main camera and a 50mm telephoto lens.

DCS’ leak also suggests that the Civi 4 may flaunt the Leica branding for the rear cameras, but it is unclear whether it will be there on the final product. The leaker did not say anything about the launch timeframe. However, previous reports have claimed that it may launch as early as March of this year.

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