Yesterday, some key specifications of the RedMagic 11 Air were teased, and now additional official details about the smartphone’s cooling technology have been revealed.
Here is more to it.
Redmagic 11 Air Cooling Tech Revealed
According to the teasers, the RedMagic 11 Air will feature a built-in active cooling fan using the brand’s Drive Wind 4.0 system, with a stated speed of up to 24,000 RPM. The company claims it is the only “Air” smartphone to include an internal cooling fan.
The teasers also mention an aviation-grade aluminium air cooling bracket, which is said to offer higher thermal conductivity while keeping weight low. The structure is designed to direct airflow towards internal heat sources to improve heat dissipation.
Additionally, the device is expected to feature an ultra-thick vapour chamber (VC) with a patented heat dissipation design. RedMagic claims this design increases vapour space and improves heat balancing efficiency by 47%, while the high-density internal structure improves thermal circulation efficiency by 30% compared to standard VC designs.
These cooling components are part of the company’s newly announced ICE Magic Cooling System, which integrates the fan, VC, and cooling bracket into a single thermal solution.
