Honor is reportedly working on the Honor Magic 6 series of flagship phones for the Chinese market. Initial leaks suggest that the lineup will comprise three models, such as the Honor Magic 6, Magic 6 Pro, and Magic 6 Ultimate. While the Magic 5 series, which debuted in March of this year in China, features the Snapdragon 8 Gen 2 chipset, the upcoming Magic 6 series will reportedly have the latest Snapdragon 8 Gen 3. A couple of leaked shots of what appears to be the Magic 6 / 6 Pro have emerged on Weibo.
Honor Magic 6 Pro design revealed
To recall, the Honor Magic 5 incorporates a curved-edge display with a centred punch-hole design. In contrast, the Magic 5 Pro also includes a curved-edge screen, but it features a pill-shaped cutout situated in the upper-left corner.
Leaked information that surfaced last month revealed that the Magic 6 Pro would feature a centrally located pill-shaped cutout. The newly leaked image of the Magic 6 Pro that has surfaced on Weibo aligns with its rumoured display design. However, another image reveals the rear side of the phone, but it’s difficult to discern the design as the device is enclosed in a heavily protective case.
Nevertheless, a different source has provided a render created based on the speculations surrounding the Magic 6 Pro. It maintains the round camera module with three cameras, seemingly including a ToF 3D depth sensor and an LED flash, similar to the Magic 5 Pro. Although the design remains somewhat consistent, there are subtle differences in the arrangement compared to the predecessor. Reports state that the Magic 6 series will debut before the 2024 Chinese Spring Festival, which suggest that it may launch by January end or by early February.
