The Honor WIN 2 series and Honor WIN Pad are scheduled to launch in the Chinese market on the 21st of October 2026, and the brand has already been teasing their key specs and features. Now, the tablet’s chipset and the smartphone series’ cooling system details have also been officially revealed.
Here’s more about the update.
Honor WIN Pad and WIN 2 Series – Latest Teasers Reveal Chipset and Cooling Details
About the upcoming Honor WIN Pad, it will be powered by Qualcomm’s Snapdragon 8 Elite Gen 5 chip, and the brand is promoting it as a gaming tablet with a focus on performance. Regarding its design, the revealed rear panel features a single camera, along with what appears to be a cooling fan with a lighting effect inside the fan grill.
Moving on to the Honor WIN 2 series, the smartphones will be featuring the Honor Dongfeng dual TurboStar vortex cooling system. The brand claims that this brings an industry-first three-dimensional dual-fan cooling architecture, with each fan capable of operating at up to 31,000rpm.
Additionally, the combined airflow is claimed to exceed the industry level, while the cooling system is said to reduce the device temperature by 10°C within 50 seconds. Honor also claims that it is the first to receive SGS certification for efficient full-device heat dissipation.
Speaking more, with the launch of both the Honor WIN 2 series and Honor WIN tablet taking place on the 21st of October 2026, more specifications are likely to be teased in the coming days. Stay tuned until then.
