Honor Magic 8 Pro Air teased to arrive with Honor Sound Stereo Dual speakers and aerospace aluminium integrated mid-frame; Honor Magic 8 RSR confirmed to feature Snapdragon 8 Elite Gen 5 SoC and 24GB LPDDR5X RAM

The Honor Magic 8 Pro Air and Honor Magic 8 RSR Porsche Design smartphones will be launching in the Chinese market on 19^th January, and till now, a lot of details related to these devices have been revealed online.

Today, some new features of these upcoming devices have been shared online.

Honor Magic 8 Pro Air: Key details revealed

The smartphone comes with Honor Cicada Wing Architecture and aerospace aluminium integrated mid-frame that easily resists bending and compression. It is said to boast a slim and lightweight body. The device supports multiple focal lengths- 74mm, 46mm, and 23mm.

The device supports quad SIM and dual standby. It comes with support for eSIM and physical SIM. It features IP69+IP68 dust and water resistance and is waterproof to a depth of up to 6 meters. It is built with a self-developed high-strength 7-series aluminium alloy and aerospace-grade materials with a total bending strength of 100kg. The smartphone will be equipped with Honor Sound stereo dual speakers.

Honor Magic 8 RSR Porsche Design: Key details revealed

The smartphone is officially confirmed to feature the Snapdragon 8 Elite Gen 5 SoC and will offer 24GB LPDDR5X RAM. It also supports multiple focal lengths: 23mm, 46mm, 50mm and 85mm.

Check out the previously revealed details of the Honor Magic 8 Pro Air and Honor Magic 8 RSR Porsche Design here.

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