Manufacturers like Samsung, SK Hynix and Micron have been dominating the DRAM manufacturing market. But with the surging demand for memory chips and a shortage of supplies, it is said that this could be a great opportunity for other manufacturers to enter the market, with various big companies already exploring options to meet their demands.
Online reports have now revealed that the Chinese manufacturer CMXT’s (ChangXin Memory Technologies) LPDDR6 memory has already entered the sampling stage, and mass production is said to begin in the second half of this year.
CMXT LPDDR6 memory could enter mass production in H2 2026
Samsung and SK Hynix are already developing DDR6 memory, and it appears that CMXT is also accelerating its roadmap for next-generation memory.
As per reports, CMXT has added Haesung DS as a new packaging substrate supplier, and it is shifting from reel-to-reel manufacturing to panel-level packaging, which is said to be a better approach for DDR6’s complex multi-layer design. Earlier, the reel-to-reel method was used for DDR5 and DDR4 manufacturing.
The upcoming LPDDR6 chips are said to offer speeds of up to 12.8Gbps, and their commercial adoption is expected around 2028 to 2029.
CMXT’s LPDDR6 memory is said to have entered the sampling stage, while its mass production is tipped to begin in H2, 2026. It is rumoured that Apple is testing CMXT memory chips, but nothing can be confirmed as of yet.
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