MediaTek Dimensity 9200, Snapdragon 8 Gen 2, MediaTek Dimensity 8200 to release this year, check out the details

By Somya Agrawal Published on October 23, 2022, 15:14 IST

This year will mark the release of three unbelievably amazing processors, MediaTek Dimensity 9200, Qualcomm Snapdragon 8 Gen 2, and MediaTek Dimensity 8200. Let’s check out the details.

MediaTek Dimensity 9200

In November, the Cortex-X3 CPU and G715 GPU of MediaTek’s Dimensity 9200 chipset are expected to be available for purchase.
The Immortalis G715 GPU and ARM Cortex-X3 processor on the MediaTek Dimensity 9200 work together. According to a reliable source, the ARM Cortex-X3 outperforms the Cortex-X2 by 25% in terms of speed. Although the architecture and clock speed have not yet been revealed, the chipset’s performance is much better than expected.
The chipset’s Cortex-A710 and Cortex-A510 cores might not change, and TSMC’s 4nm production node will still be used to make the chipset.
It is rumored that it will power the upcoming Vivo X90 series and OPPO Find X series devices.

Qualcomm Snapdragon 8 Gen 2

In November, Qualcomm will release its newest premium processor, the Snapdragon 8 Gen 2. It now appears like Qualcomm, which is competing against Apple’s A16 Bionic and MediaTek’s replacement for the Dimensity 9000 series, may have an advantage on one of those fronts.

The Snapdragon 8 Gen 2 is expected to have two Cortex-A715 cores instead of two Cortex-A720 cores. 3.2GHz is the Cortex-maximum X3’s clock speed, while 2GHz is the Cortex-maximum A510’s. The maximum clock speed for the Cortex-A715 and Cortex-A710 cores will be 2.8GHz.

MediaTek Dimensity 8200

MediaTek Dimensity 8200 is expected to release soon. According to the Chinese leaker Digital chat station, the Dimensity 8200 chipset is currently being “testing,” which suggests that the chip is still in development and is thus to be expected.
The MediaTek (Next-Gen) flagship SoC, which should be unveiled at the end of the year, will be housed on a TSMC node. The upcoming chipset will reportedly be the first to utilize TSMC’s 3-nanometer technology.