The iQOO Neo 7 SE debuted in December 2022 in China as the first-ever phone powered by the Dimensity 8200 chipset. The same chipset has been available on other phones, such as the Redmi K60e, Vivo V27 Pro, and Vivo S16 Pro. Today, Xiaomi confirmed that the upcoming Xiaomi Civi 3 will come equipped with the Dimensity 8200-Ultra, which is nothing but a customised version of the D8200.
There have been some doubts about the name of the next Xiaomi Civi phone. However, the poster also confirms that the upcoming Civi phone will debut with the Xiaomi Civi 3 moniker.
The company is yet to confirm the launch date of the Xiaomi Civi 3. However, rumours are rife that it will be announced on May 30 in the home market.
According to reports, the Civi 3 may continue to feature a 6.55-inch OLED panel with curved edges like the Civi 2. It will also have a pair of 32-megapixel selfie cameras on the front. On the back, it will have a Sony IMX800-series primary camera.
The Dimensity 8200-Ultra-powered device is expected to ship with up to 12 GB of RAM and 512 GB of storage. The handset is likely to support 67W fast charging. A recent Weibo post released by the brand revealed that there will be a special edition version of the Civi 3, which will be released in partnership with Disney.
