Samsung Electronics begins shipping the industry’s first 12-layer HBM4E samples to major global customers
The South Korean tech giant Samsung today announced that it has begun shipping the industry’s first 12-layer HBM4E samples to major global customers. Samsung’s 12-layer HBM4E achieves speeds of up to 16Gbps with improved energy efficiency and thermal performance.
“Following the successful mass production of HBM4, Samsung has once again demonstrated its distinct technological edge with HBM4E,” said Sang Joon Hwang, Executive Vice President and Head of Memory Development at Samsung Electronics. “Through our advanced manufacturing capabilities and preemptive infrastructure investments, we will continue to drive the growth of the global AI memory market.”
Samsung Electronics Begins Shipment of Industry-First HBM4E Sampleshttps://t.co/XvCXiVrduo
— Samsung Electronics (@Samsung) May 28, 2026
About Samsung HBM4E
Samsung’s HBM4E delivers a stable pin speed of 14Gbps with performance scalable up to 16Gbps to support increasingly intensive data processing requirements. This represents more than a 20% increase over its HBM4, while delivering memory bandwidth of up to 3.6TB per stack.
It is offered in 48GB capacity with plans to expand the lineup to include 32GB (8-layer) and 64GB (16-layer) configurations in accordance with customer requirements. The HBM4E includes the industry’s most advanced 6th-gen 10-nanometer (nm)- class DRAM process (1c) and Samsung Foundry’s 4nm logic base die, which allows for secure enhanced process stability and manufacturability.
Samsung’s HBM4E comes with design and process optimisation across both memory and logic architectures. Advanced low-power design technologies and optimised packaging structures improved energy efficiency by 16% and thermal resistance characteristics by more than 14% compared to the previous generation.
These enhancements enable more effective heat dissipation, allowing prolonged reliability and lower energy consumption in next-gen data centers with intensive workloads.
Samsung plans to begin mass production for HBM4E aligned with customer schedules, following initial sample shipments and optimisations. As a stable supply of HBM4 continues to grow, the company’s latest HBM4E using the same combination of core and base die is anticipated to enter mass production to further accelerate innovation in next-generation AI systems.
