Read more about it below.

Google TPU v9 Triggerfish: Production and Specs Tipped

Based on what has been revealed in his X/Twitter post, Ming-Chi Kuo states that the upcoming Triggerfish chip will be a Humufish-based follow-on program, positioned as a TPU v9 variant with stronger inference capabilities. The project also further confirms MediaTek as Google’s preferred development partner for the TPU v9 generation.

About the key differences when compared to Humufish, Ming-Chi Kuo points out that the SRAM capacity has been significantly increased to 2 to 3 times that of Humufish. Along with this, a new simulation die has also been added, while the memory has been upgraded to HBM4E instead of the HBM4 memory used on Humufish. With these upgraded specs, this new variant is expected to help mitigate both the CPU wall and the memory wall, which are two of the key limitations faced in advanced AI workloads.

Notably, the Humufish lifetime shipments are still estimated to be around 4 to 5 million units. Google is now adding an incremental Triggerfish order of around 1 to 2 million units, with production expected to begin in late 2027 and its volume ramp likely to take place in 2028.

But this upgrade isn’t going to come cheap, according to Kuo, the upgraded Triggerfish codenamed TPU V9 is going to cost 30% higher than Humufish. The analyst also points out that this could become an incremental driver of MediaTek’s 2028 business momentum. With AI agents and reinforcement learning expected to become more important in the coming years, Google’s upgraded TPU v9 Triggerfish chip could play a key role in improving the brand’s future AI infrastructure.

Stay tuned for more updates.

The post Google TPU v9 Triggerfish With MediaTek Tipped: HBM4E Memory, 3x SRAM Capacity, Production From Late 2027 appeared first on The Tech Outlook.

A new era of PC.

25.0528, 121.5990

— NVIDIA (@nvidia) May 29, 2026

Interestingly, a similar post was shared by tech giants Arm, MediaTek and Microsoft’s Windows.

Though the companies have not officially revealed what this mysterious post is all about, reports suggest that the tease could be related to NVIDIA’s upcoming N1/N1X Windows-on-Arm chips, which are reportedly being developed in partnership with MediaTek.

The chips are expected to arrive with up to a 20-core Arm-based CPU for handling everyday tasks and productivity workloads, a Blackwell-based NVIDIA GPU for graphics, gaming and AI workloads. It is also said to include a dedicated NPU to accelerate AI features directly on the device, while the chips are rumoured to focus on better power efficiency and battery life compared to traditional laptop processors.

Let’s see what NVIDIA has planned for its users. More details are expected to be revealed at the Computex 2026 keynote speech on June 1.

Stay tuned with The Tech Outlook for the latest tech updates.

The post NVIDIA, Microsoft’s Windows, Arm and MediaTek officially tease ‘a new era of PC’ ahead of Computex 2026 appeared first on The Tech Outlook.

Read more about it below.

MediaTek’s Dimensity 7500 Processor

To note, Arm retired its traditional “Cortex-X” and “Cortex-A” naming scheme in September last year and introduced the new C1 branding for its latest CPU cores. MediaTek had already adopted this new core design with its Dimensity 9500 flagship chipset, and the same naming approach is now being used on the newly unveiled Dimensity 7500 as well.

Comparing MediaTek’s Dimensity 7500 chipset with that of the Dimensity 7400 chipset from the brand, the latest Dimensity 7500 uses the Arm C1 Pro and Arm C1 Nano cores instead of the Cortex-A78 and Cortex-A55 cores that were used in the previous Dimensity 7400 SoC, both running at 2.6GHz and 2.0GHz, respectively. MediaTek also claims that the latest Dimensity 7500 offers up to 9% better power efficiency and up to 68% faster video transcoding.

Coming to its memory and storage support, the newly introduced Dimensity 7500 chipset supports LPDDR5 RAM with up to 6400Mbps frequency and UFS 3.1 2-lane storage. The chipset is also integrated with the Arm Mali-G625 MC2 GPU and comes with the MediaTek NPU 850 for handling AI-related tasks.

Speaking more about the connectivity features, the Dimensity 7500 supports 2G-5G multi-mode connectivity, 5G/4G carrier aggregation, 5G/4G FDD and TDD, CDMA2000 1x/EVDO Rev. A, EDGE, GSM, TD-SCDMA, and WCDMA. It also supports SA and NSA modes, NR TDD and FDD bands, DSS, NR DL 3CC 220MHz bandwidth, 4×4 MIMO, 256QAM, NR UL 2CC, R16 UL enhancement, VoNR, EPS fallback, and Smart Network Suite 3.0. The chipset offers a peak downlink speed of 5.2Gbps.

Other key specifications include GPS, BeiDou, Glonass, Galileo, QZSS, and NavIC GNSS support, Wi-Fi 6E, up to 2T2R Wi-Fi antenna support, Bluetooth 5.4, Bluetooth Hybrid Coexistence, Bluetooth Long Range, and Xtra Range 3.0. For camera and video, the Dimensity 7500 supports up to a 200MP camera sensor, 4K30 10-bit video capture, 4K HDR video recording, and main cameras of up to 200MP with 14-bit DCG sensors.

Regarding its display support, the chipset can support a primary display of up to 1344 x 2800 pixels at 144Hz and a secondary display of up to 1300 x 1200 pixels at 120Hz. It also supports 1.5K+ displays and MediaTek Adaptive Gaming Technology 4.0. Video encoding support includes H.264 and HEVC, while video playback support includes H.264, HEVC, and VP-9.

Just to add, a few early rumours claim that this same chipset is expected to be featured in the upcoming Vivo S60 Vitality Edition and Redmi Note 17 Pro Max smartphones. However, an official confirmation regarding this is still awaited.

Stay tuned for more updates.

The post MediaTek Dimensity 7500 Officially Unveiled With Arm C1 Cores, 9% Better Power Efficiency and 68% Faster Video Transcoding appeared first on The Tech Outlook.

Here are the details

MediaTek Dimensity 8550 SoC

Powered by MediaTek’s powerful NPU 880 and an ever-growing generative AI ecosystem, the MediaTek Dimensity 8550 SoC includes LLM Boosters and support for the latest Google Gemini Nano V3. It comes with Diffusion Transformer support, NeuroPilot hardware compression technology, Mixed-precision INT4 quantisation technology, and accelerates LLM inference with speculative decoding support.

The chipset is packed with an all Big Core CPU design and large in-chip caches:

• 1x Arm Cortex-A725, up to 3.4GHz, IMB L2
• 3x Arm Cortex-A725, up to 3.2GHz, 512KB L2
• 4x Arm Cortex-A725, up to 2.2GHz, 256KB L2
• 6MB L3
• 5MB SLC

The Arm Mali-G720 MC8 GPU, supercharged with MediaTek HyperEngine technology, takes premium mobile gaming to the next level. Gamers can dive into their favourite games at 120fps for ultra-responsive competitive play, or push visuals to extreme HDR settings while maintaining smooth performance.

The chipset comes with support for Imagiq 1080: flagship-grade image quality. At the core is support for QPD- Bayer QPD camera sensors, while users can experience cinema-grade video recording with crystal clear detail, enhanced by 100% PDAF for razor-sharp focus at any distance and AI-powered Zero Shutter Lag photos. It supports 4K HDR video capture with HDR visuals supported across the entire range.

MediaTek’s 5G Advanced Modem features the all-new 3^rd generation Smart Network Suite with advanced 2^nd gen Subway Mode, which instantly reconnects the moment you step out of a cellular dead zone. There is also support for R16 UL Enhancement, MediaTek UltraSave 3.0+ and 2^nd generation Dual SIM Dual Active.

It supports LPDDR5X 4ch RAM at 9600Mbps and UFS 4+ MCQ storage type. Connectivity features supported are GNSS, WiFi 6E, 2T2R WiFi Antenna and Bluetooth 5.4. The chipset supports a 320MP camera or sensor or 3x32MP @30fps. WQHD+ resolution up to 144Hz refresh rate, and dual screen is supported for display.

Recently, Honor 600 Pro has made its debut in China with MediaTek Dimensity 8550 Elite SoC, while Oppo Reno 16 has also arrived with MediaTek Dimensity 8550 Super SoC.

The post MediaTek Dimensity 8550 SoC officially unveiled; Check out the specs and features appeared first on The Tech Outlook.

Here are the details

MediaTek Dimensity Developer Conference 2026: Announcements

This year’s Dimensity Developer Conference focuses on MediaTek’s full-stack technology and all-scenario product portfolio, enabling ubiquitous intelligent agent experiences and empowering a new era of intelligent agents.

As per the company, in future, it won’t be just smartphones with AI; cars, tablets and various devices will gradually become intelligent agents that “proactively help you,” and these devices will be able to collaborate.

Dimensity focused on four layers: Terminal layer, System layer, Application layer and AI Infrastructure layer. The terminal layer makes devices like smartphones and cars smarter; the System layer allows system-level AI to take over more operations; the application layer makes it easier for developers to create AI apps, and the AI Infrastructure layer uses strong AI computing power and infrastructure to support the entire ecosystem.

The Dimensity 9500 chipset features a high-performance+high-efficiency dual NPU, empowering developers across the entire stack to easily overcome three layers of challenges in mobile terminal intelligent agent development:

• Terminal layer: Achieving a balance between full-modal computing power and power consumption.
• System Layer: Enhancing the upper limit of intelligent agent development, making the system more secure and proactive.
• Ecosystem Layer: Integrating the ecosystem, enabling intelligent agent experiences to be “ubiquitous” across terminals and scenarios.

Then there is Dimensity AI Intelligent Agent Engine 2.0. Based on Dimensity SensingClaw, Agent OS possesses proactive perception capabilities such as vision, hearing, and orientation awareness, enabling a shift from passive commands to proactive services. It easily breaks down complex tasks and can leverage a rich application ecosystem to complete tasks through composite execution.

Dimensity AI Development Kit 3.0 is also unveiled. It comes with a Visualised LVM model deployment that is 50% more efficient than the previous generation. The Low Bit compression toolkit delivers up to 58% model compression, while the Dimensity eNPU development tool brings Always-On perception capabilities. The Dimensity AI Partner is launched, providing intelligent assistance and end-to-end deployment of four kits, fully unleashing the potential of AI and making advanced intelligent agent experiences “ubiquitous”.

MediaTek is collaborating with developers to create a proactive, intelligent, and integrated cockpit experience, offering three major development shortcuts:

• A more powerful AI cockpit platform- Powerful computing power and advanced architecture, handling computing power, bandwidth, and concurrency all in one go.
• More convenient AI development tools: Easily deploy and continuously update with the Dimensity AI Development Kit
• A stronger open ecosystem: The Dimensity software platform connects to a rich ecosystem, co-creating commercial value.

The MediaTek Dimensity Cockpit Platform C-X1, equipped with an NVIDIA GPU cockpit chip, boasts console-level graphics rendering capabilities, hardware-level ray tracing technology, and supports DLSS neural network rendering technology, delivering a 4K 60fps AAA gaming experience for passengers. The cockpit can understand voice, vision, hearing, emotions, health, and environmental information, always empathizing with you. It provides proactive service, concurrent task execution and edge-cloud collaboration.

Dimensity Profiler, a one-stop analysis tool for Android game optimisation for developers, tackles 3 major optimisation challenges:

• One-stop analysis: Solves issues such as fragmented Android game optimisation environments and switching between multiple tools and systems.
• Automatic issue saving: Accurately captures occasional stuttering, enabling targeted optimisation and ensuring high and stable frame rates.
• Seamless integration into existing automated testing: Supplements data dimensions and improves test quality.

MediaTek has invited developers to experience the more user-friendly and comprehensive Dimensity Profiler 2.0.

Disclaimer: The above features are translated from Chinese to English.

The post Check out the latest innovations unveiled at the MediaTek Dimensity Developer Conference 2026 appeared first on The Tech Outlook.

MediaTek Dimensity 7450 & Dimensity 7450x: Features

Both chipsets support the global 5G standard defined by 3GPP Release 17. This enables the latest 5G connectivity features for higher average speeds, broader coverage, and improved reliability, while maintaining excellent power efficiency.

The chipsets are built on a 4nm-class process and feature an octa-core CPU setup with 4 Cortex-A78 cores clocked at up to 2.6GHz and 4 Cortex-A55 efficiency cores. For graphics, the chipsets come with Arm Mali-G615 MC2.

MediaTek has integrated its sixth-generation NPU to improve on-device AI processing. The in-chip NPU increases performance by up to 7%. AI Camera tasks deliver impressive performance and power efficiency upgrades over previous-generation chipsets.

They support LPDDR5 and LPDDR4X RAM, with memory speeds of up to 6400Mbps. For storage, they support UFS 2.2 and UFS 3.1. The chipsets include MediaTek HyperEngine Gaming technology that comes with MediaTek Adaptive Gaming Technology 3.0 and MediaTek’s Network Observation System (NOS).

Support for up to 140MHz of 5G spectrum enables downlink speeds of up to 3.27Gb/s using 3CC carrier aggregation. Combined FDD and TDD duplex support helps deliver faster and more consistent performance in both urban and suburban environments. In addition, 3CC carrier aggregation allows smoother transitions between 5G coverage areas, within the same layer, offering more than 30% greater throughput layer coverage compared to networks without carrier aggregation.

The chipsets arrive with MediaTek 5G UltraSave 3.0+ and scenario-specific enhancements. Featuring a 12-bit HDR ISP and support for up to 200MP main cameras, the imagiq 950 ISP enhances image quality with advanced hardware engines for precise noise reduction, face detection, and video HDR. Google Ultra HDR support further improves the end-to-end HDR photography experience through gain maps that preserve additional light intensity data, resulting in more detailed highlights and shadows with richer, more intense colours. They support 4K30 video recording.

The chipsets support WiFi 6E, Bluetooth 5.4 and 2T2R Wi-Fi antenna. Display support extends up to WFHD+ resolution at 120Hz and FHD+ resolution at 144Hz refresh rates.

If reports are to be believed, the Motorola Razr 70 could be powered by the all-new MediaTek Dimensity 7450x chipset.

The post MediaTek Dimensity 7450 and Dimensity 7450x chipsets officially announced appeared first on The Tech Outlook.

MediaTek Dimensity 9600 Pro: New details tipped

The chipset is tipped to arrive with a dual-core all-big-core architecture and features two “Canyon” cores, three ‘Gelas-b” cores and three “Gelas” cores. The primary core could arrive with a maximum frequency of nearly 5GHz.

It is said to support SME2 and feature an Arm Magni GPU. The chipset may arrive with support for LPDDR6 RAM and UFS 5.0 storage. It is built with TSMC N2P, GGA advanced process. According to the tipster, internal technical specifications have revealed a 10%-15% performance improvement and a 25%-20% reduction in power consumption.

The increase in maximum clock speed suggests that MediaTek is pushing to bring desktop-level processing capabilities to mobile devices. With the increase in maximum clock speed for the primary core, MediaTek may advise smartphone makers to include more sophisticated cooling systems so that the smartphones do not face heating constraints.

Online reports suggest the MediaTek Dimensity 9600 “Pro” variant may also be accompanied by a standard MediaTek Dimensity 9600 version with slightly less aggressive clock speeds.

Stay tuned with The Tech Outlook for the latest tech updates.

The post New details related to the upcoming MediaTek Dimensity 9600 Pro tipped online appeared first on The Tech Outlook.

Yesterday, Charles Guillemet, CTO at Ledger, revealed that Donjon, the hardware security research team run by Ledger, discovered a MediaTek vulnerability that is potentially impacting millions of Android phones.

Vulnerability found in MediaTek powered Android phone

According to the X post, the Donjon team plugged the CMF Phone 1 by Nothing (powered by MediaTek Dimensity 7300 5G) into a laptop and breached the phone’s foundational security within 45 seconds. Without ever even booting into Android, the exploit automatically recovered the phone’s PIN, decrypted its storage, and extracted seed phrases from popular software cryptocurrency wallets.

It is said that the vulnerability could affect millions of Android devices with MediaTek processors that use Trustonic’s Trusted Execution Environment (TEE). Many MediaTek devices rely on TEE, a secure area inside the main processor to protect sensitive data.

As per Charles, this research highlights a fundamental architectural difference- general-purpose chips are built for convenience, while secure elements are built for key protection.

The vulnerability found in the MediaTek chipset is now public (CVE-2025-20435). It is revealed that the research team has followed a strict responsible disclosure process and has informed MediaTek about this vulnerability before making it public.

MediaTek has confirmed providing a fix for this issue to OEMs on 5^th January, 2026, which means the vulnerability should be patched in software updates. It is not known whether this vulnerability has been exploited by the attacker or its potential impact on existing devices.

The processors that are revealed to be affected are:

• MT2737
• MT6739
• MT6761
• MT6765
• MT6768
• MT6781
• MT6789
• MT6813
• MT6833
• MT6853
• MT6855
• MT6877
• MT6878
• MT6879
• MT6880
• MT6885
• MT6886
• MT6890
• MT6893
• MT6895
• MT6897
• MT6983
• MT6985
• MT6989
• MT6990
• MT6993
• MT8169
• MT8186
• MT8188
• MT8370
• MT8390
• MT8676
• MT8678
• MT8696
• MT8793

The affected processors include those that are equipped in entry-level to flagship phones from Oppo, Vivo, OnePlus and Samsung.

The post Security researchers discovered a vulnerability in MediaTek-powered Android phones; Researchers broke into the CMF Phone 1 by Nothing in just 45 seconds appeared first on The Tech Outlook.

Oppo & MediaTek at MWC 2026

At the event, the company showcased new on-device AI capabilities, progress on the jointly developed Omni model and advances in cross-ecosystem connectivity.

Oppo is advancing its AI strategy centred on “New Computing, New Perception, and New Ecosystem.” At the core of this strategy is “One-device Compute”, enabling low-latency, privacy-preserving, and personalised AI experiences.

On-device AI capabilities

It is revealed that powered by the MediaTek Dimensity 9500 platform, Oppo’s self-developed on-device AI Translate and AI Portrait Glow now deliver performance comparable to cloud-based solutions. According to Oppo, these features will soon be rolled out to the Oppo Find X9 series through the upcoming ColorOS 16 software update.

The on-device AI Translate can run directly on the device, achieving an average 15% improvement in accuracy over conventional approaches while supporting seamless multilingual translation. The on-device AI Portrait Glow enhances portraits captured in challenging environments.

Progress on the jointly developed Omni model

The companies unveiled a technology preview of Omni, the industry’s first on-device full-modal AI model designed for multi-modal understanding and interaction. The model supports voice, video and text inputs, enabling live scene understanding and interactive Q&A directly on a smartphone. This is said to lay the foundation for more proactive and natural human-computer interaction.

Advances in cross-ecosystem connectivity

At the MediaTek Booth, attendees got to explore Find X9 Pro’s on-device AI capabilities alongside its telephoto imaging with the Oppo Hasselblad Teleconverter. While Oppo Reno 15 Pro was also featured, presenting creative AI imaging tools including AI Motion Photo Eraser, AI Motion Photo Popout, and AI Flash Photography.

Other than these innovations, it is also revealed that the Oppo Find X9 series will soon bring Android Quick Share, enabled in close collaboration with MediaTek and Google. With this feature, without installing third-party apps, users can conveniently and securely transfer files between Oppo smartphones and iOS, iPadOS and macOS devices, improving cross-platform interoperability. This feature is expected to begin rolling out via software update starting in March.

At MWC 2026, the Oppo Find X9 Pro smartphone was also shortlisted for the “Best Smartphone” award at the GLOMO awards.

The post Oppo and MediaTek unveil on-device AI Innovations at MWC 2026; Progress on Omni model, advances in cross-ecosystem connectivity and more appeared first on The Tech Outlook.

Well, the Indian consumers will also soon get to purchase the MediaTek Dimensity 9500s-powered smartphones in the country. Today at the MediaTek event, POCO, Realme and Oppo have officially confirmed that they will soon launch their MediaTek Dimensity 9500s-powered smartphones in India.

POCO is said to launch the POCO X8 Pro Max device with this chipset, Realme GT 8 is also said to arrive with this chipset, while Oppo Find X9S smartphone is said to make its debut powered by the MediaTek Dimensity 9500s SoC. The companies are expected to soon start teasing the arrival of these devices.

MediaTek Dimensity 9500s: Features

The chipset comes with one Cortex-X925 core clocked at 3.73GHz, three Cortex-X4 cores clocked at 3.30GHz, and four Cortex-A720 cores clocked at 2.40GHz. It is paired with the Arm Immortalis-G925 GPU that supports ray tracing. The game energy efficiency is improved by Star Speed Engine Adaptive Technology 3.0 and Dimensity Frame Multiplication Technology 3.0. It supports LPDDR5X RAM at 9600 Mbps and UFS 4 storage.

MediaTek’s high-end NPU delivers more powerful edge-side generative AI and agent AI capabilities. Next-generation Dimensity AI Development kit support, wide support for SLM+LLM AI models, flagship-level Stable Diffusion XL, and video generation capabilities are some of its other features.

The 5G R17 modem supports four-carrier aggregation, and downlink speeds up to 7Gbps. MediaTek UltraSave 4.0 and AI Network Kit 2.0 offer outstanding energy efficiency. The chipset supports WiFi 7, Bluetooth 5.4, and MediaTek Xtra Range 3.0 technology. It offers 320MP maximum camera sensor support, 108MP @ 30fps support, and 3x36MP @ 30fps support. The chip also supports 8K Dolby Vision video recording. It comes with support for Tri-port MIPI for Tri-Fold displays and WQHD+ 180Hz. The MediaTek UltraSave 4.0 and R17 Power Saving Enhancement features help in power saving.

The post POCO, Realme & Oppo confirmed to soon launch MediaTek Dimensity 9500s-powered smartphones in India appeared first on The Tech Outlook.