While announcing its Q3, 2025 financial results, Samsung announced that in 2026, the company will be focusing on the mass production of HBM4 products. Today, the South Korean tech giant has officially announced that it has begun mass production of its industry-leading HBM4 and has shipped commercial products to customers.
Samsung Ships Industry-First Commercial HBM4 With Ultimate Performance for AI Computinghttps://t.co/tesdvlT4XA
— Samsung Electronics (@Samsung) February 12, 2026
“Instead of taking the conventional path of utilising existing proven designs, Samsung took the leap and adopted the most advanced nodes like the 1c DRAM and 4nm logic process for HBM4,” said Sang Joon Hwang, Executive Vice President and Head of Memory Development at Samsung Electronics. “By leveraging our process competitiveness and design optimisation, we are able to secure substantial performance headroom, enabling us to satisfy our customers’ escalating demands for higher performance, when they need them.”
Samsung’s HBM4
The HBM4 delivers a consistent processing speed of 11.7Gbps, exceeding the industry standard of 8Gbps by approximately 46% and setting a new benchmark for HBM4 performance. HBM4’s performance can be further enhanced up to 13Gbps. Total memory bandwidth per single stack is increased by 2.7x compared to HBM3E, to a maximum of 3.3 TB/s.
Samsung offers HBM4 in capacities ranging from 24GB to 36GB, through 12-layer stacking technology. While in the future, the company will also keep its capacity options aligned with future customer timelines by utilising 16-layer stacking, which will expand offerings up to 48GB.
HBM4 achieves a 40% improvement in power efficiency by leveraging low-power voltage through silicon via (TSV) technology and power distribution network (PDN) optimisation, while enhancing thermal resistance by 10% and heat dissipation by 30%, compared to HBM3E.
A tightly integrated Design Technology Co-Optimization (DTCO) between the company’s Foundry and Memory Business allows HBM4 to secure the highest standards of quality and yield. Additionally, extensive in-house expertise in advanced packaging allows for streamlined production cycles and reduced lead times.
It is anticipated that Samsung’s HBM sales will more than triple in 2026 compared to 2025, while the company is proactively expanding its HBM4 production capacity. After the introduction of HBM4, sampling for HBM4E is said to begin in the second half of 2026, while custom HBM samples will start reaching customers in 2027.
